1～3 item / All 3 items
Wafer Mask Sheet Spin Cleaning Device
It is also possible to combine with ozone water (20ppm), excimer UV, and atmospheric pressure plasma as options. Additionally, it excels in versatility with combinations such as ULPA/HEPA units and chemical supply units.
This is a device that performs brush cleaning, ultrasonic cleaning, rinse cleaning, and N2 blow drying processes!
This is a space-saving, double-sided washable mechanism for a sheet-type spin cleaning device. It is easy to maintain and features high-speed spin drying and N2 drying, which reduces water marks. (Patent No. 3558543)
Accommodating various process needs with a diverse range of chamber forms! Work sizes range from 2-inch to 12-inch wafers.
The "Sheet-type Spin Cleaning Device" can be equipped with ultrasonic spray nozzles, two-fluid spray nozzles, high-pressure jet nozzles, ozone water, and more, allowing for processing tailored to specific applications. It accommodates work sizes from 2-inch to 12-inch wafers. It can also handle square substrates up to 500mm on a side (consultation required). The device can be configured with process modules for acidic, alkaline, and organic solutions. 【Features】 ■ Versatile chamber configurations to meet various process needs ■ Compatible with work sizes from 2-inch to 12-inch wafers ■ Can also accommodate square substrates up to 500mm on a side (consultation required) ■ Configurable with process modules for acidic, alkaline, and organic solutions *For more details, please download the PDF or feel free to contact us.
