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Single wafer spin cleaning machine Product List

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Wafer Mask Sheet Spin Cleaning Device

Wafer Mask Sheet Spin Cleaning Device

It is also possible to combine with ozone water (20ppm), excimer UV, and atmospheric pressure plasma as options. Additionally, it excels in versatility with combinations such as ULPA/HEPA units and chemical supply units.

  • Other semiconductor manufacturing equipment
  • Single wafer spin cleaning machine

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Single-leaf spin cleaning device

Accommodating various process needs with a diverse range of chamber forms! Work sizes range from 2-inch to 12-inch wafers.

The "Sheet-type Spin Cleaning Device" can be equipped with ultrasonic spray nozzles, two-fluid spray nozzles, high-pressure jet nozzles, ozone water, and more, allowing for processing tailored to specific applications. It accommodates work sizes from 2-inch to 12-inch wafers. It can also handle square substrates up to 500mm on a side (consultation required). The device can be configured with process modules for acidic, alkaline, and organic solutions. 【Features】 ■ Versatile chamber configurations to meet various process needs ■ Compatible with work sizes from 2-inch to 12-inch wafers ■ Can also accommodate square substrates up to 500mm on a side (consultation required) ■ Configurable with process modules for acidic, alkaline, and organic solutions *For more details, please download the PDF or feel free to contact us.

  • Other surface treatment equipment
  • Other semiconductor manufacturing equipment
  • Single wafer spin cleaning machine

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Leaf-type spin cleaning device

A sheet multi-spin processor that accommodates complex process needs with multiple chamber configurations!

We would like to introduce the "Sheet-type Spin Cleaning Device" that we handle. The work size ranges from Φ2" to 12" wafers or square substrates (up to a maximum of 600mm□). No setup changes are required for size adjustments. In the automatic type, when the cassette is set in the loader, the clean robot transports the workpiece and automatically performs chemical treatment, rinsing, and spin drying. In the manual type, the workpiece can be manually set in the chuck, and the same processes can be carried out. 【Specifications (partial)】 ■ Work materials - Si, SiC, GaN, GaAs, InP, LT/LN, ceramics, quartz, resin, glass, SUS plates, etc. ■ Chemical tanks: Chemical supply tanks and waste liquid tanks can be built into both sides of the main unit. ■ PVA disk brush can be installed. *For more details, please download the PDF or feel free to contact us.

  • 枚葉式スピン洗浄装置2.png
  • 枚葉式スピン洗浄装置3.png
  • Other cleaning machines
  • Single wafer spin cleaning machine

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